G642 is a leaded solder paste developed by our company for high-precision SMT processes. Formulated with low-oxide Sn62.9Pb36.9Ag0.2 (Type 4 powder, melting point 183°C) alloy solder powder and ROM0 classified flux. The system incorporates high-performance thixotropic agents, providing superior wettability and continuous printability, suitable for fine-pitch components (QFP, etc.).

G624 is a leaded solder paste developed by our company for high-precision SMT process requirements. Formulated with low-oxide Sn62Pb36Ag2 (Type 4 powder, melting point 179°C) alloy solder powder and RAM classified flux. The system incorporates high-performance thixotropic agents, providing superior wettability and continuous printability, suitable for fine-pitch components (QFP, etc.).

G623 is a leaded solder paste developed by our company for high-precision SMT process requirements. Formulated with low-oxide Sn62Pb36Ag2 (Type 3 powder, melting point 179°C) alloy solder powder and RAM classified flux. The system incorporates high-performance thixotropic agents, providing superior wettability and continuous printability, suitable for fine-pitch components (QFP, etc.).

G603 is a leaded solder paste developed by our company for high-precision SMT process requirements. Formulated with low-oxide Sn60Pb40 (Type 3 powder, melting point 183-195°C) alloy solder powder and ROM0 classified flux. The system incorporates high-performance thixotropic agents, providing superior wettability and continuous printability, suitable for fine-pitch components (QFP, etc.).

G64 is a leaded solder paste developed by our company for high-precision SMT process requirements. Formulated with low-oxide Sn63Pb37 (Type 4 powder, melting point 183°C) alloy solder powder and RAM classified flux. The system incorporates high-performance thixotropic agents, providing superior wettability and continuous printability, suitable for fine-pitch components (QFP, etc.).

G63 is a leaded solder paste developed by our company for high-precision SMT process requirements. Formulated with low-oxide Sn63Pb37 (Type 3 powder, melting point 183°C) alloy solder powder and ROM0 classified flux. The system incorporates high-performance thixotropic agents, providing superior wettability and continuous printability, suitable for fine-pitch components (QFP, etc.).

G53 is a leaded solder paste developed by our company for high-precision SMT process requirements. Formulated with low-oxide Sn5Pb45 (Note: Original alloy composition incorrect) alloy solder powder and RAM classified flux. The system incorporates high-performance thixotropic agents, providing superior wettability and continuous printability, suitable for fine-pitch components (QFP).

B314 is a low-temperature, water-washable solder paste developed by our company for high-precision SMT processes. Formulated with low melting point Sn43Pb43Bi14 solder powder and low-temperature flux paste. Suitable for medium-low temperature soldering processes or secondary reflow for PCBs and electronic components.