ES-1200 Die Attach Solder Paste
ES-1200 die attach solder paste is formulated with high-purity lead-free Sn96.5Ag3Cu0.5 alloy (Type 5 powder) solder powder and an ROLO grade flux vehicle. Suitable for soldering face-up LED chips larger than 10mil and flip-chip LEDs longer than 15mil.
Features:
- High thermal and electrical conductivity; alloy thermal conductivity is 50-72 W/(m·K).
- Suitable for printing processes; good thixotropy with appropriate viscosity for printing, good dispensability.
- Minimal residue; after placing the die-attached LED substrate in a 40°C constant temperature chamber for 240 hours, the residue and substrate metal show no discoloration and do not affect the LED's luminous efficacy.
